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tb6562ang/afg 2012-09-28 1 toshiba bi-cmos integrated circuit silicon monolithic tb6562ang/afg dual full-bridge driver ic for stepping motors the tb6562ang/afg is a 2-phase bipolar stepping motor driver that contains dmos transistors in the output stage. the driver achieves high effici ency through the use of low on-resistance dmos transistors and pwm current control circuitry. features 2-phase/1?2-phase/w 1?2-phase excitation pwm current control power supply voltage: 40 v (max) output current: 1.5 a (max) low on-resistance: 1.5 ? (upper and lower transistors/typ.) power-saving function overcurrent protection: i lim = 2.5 a (typ.) thermal shutdown package: tb6562ang; sdip24-p-300-1.78 TB6562AFG; ssop30-p-375-1.00 weight: sdip24-p-300-1.78: 1.62 g (typ.) ssop30-p-375-1.00: 0.63 g (typ.) ssop30-p-375-1.00 tb6562ang TB6562AFG this product has a mos structure and is sensitive to electrostatic discharge. when handling the product, ensure that the environment is protec ted against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperat ure and relative humidity are maintained at reasonable levels. special care should be taken with the following pins, which are vulnerable to surge current. pins with low surge withstand capability: tb6562ang: pins 10, 15 TB6562AFG: pins 13, 18
tb6562ang/afg 2012-09-28 2 block diagram some functional blocks, circuits, or constants may be omitted or simplified in t he block diagram for explanatory purposes. < tb6562ang > < TB6562AFG > gnd 5 v 30 2 3 28 29 14 10 11 17 21 20 1 4 5 6 27 26 25 12 13 19 18 v reg sb osc v cc out2a v cc out1a out2b v cc out1b gnd gnd phase a x1a x2a phase b x1b x2b v ref arsav ref b rsb gnd osc waveform squaring circuit control logic thermal shutdown decoder 16, 22, 23, 24 7, 8, 9, 15 gnd 5 v 24 2 3 22 23 11 7 8 14 18 17 1 4 5 6 21 20 19 9 10 16 15 v reg sb osc v cc out2a v cc out1a out2b v cc out1b gnd gnd phase a x1a x2a phase b x1b x2b v ref arsav ref b rsb gnd osc waveform squaring circuit control logic thermal shutdown decoder 13 12
tb6562ang/afg 2012-09-28 3 pin description < tb6562ang > pin no. symbol function description remarks 1 gnd ground pin 2 v reg 5 v output pin connect a capacitor between this pin and the gnd pin. 3 sb standby pin h: start, l: standby, built-in pull down resistance of 100 k ? (typ.) 4 phase a rotation direction control pin (ch. a) appl y a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 5 x1a input pin used to set output current level (ch. a) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 6 x2a input pin used to set output current level (ch. a) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 7 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 8 out1a output pin 1 (ch. a) connect to a motor coil pin. 9 v ref a input pin for external reference voltage (ch. a) 10 rsa output current detection resistor connection pin (ch. a). 11 out2a output pin 2 (ch. a) connect to a motor coil pin. 12 gnd ground pin 13 gnd ground pin 14 out2b output pin 2 (ch. b) connect to a motor coil pin. 15 rsb output current detection resistor connection pin (ch. b) 16 v ref b input pin for external reference voltage (ch. b) 17 out1b output pin 1 (ch. b) connect to a motor coil pin. 18 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 19 x2b input pin used to set output current level (ch. b) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 20 x1b input pin used to set output current level (ch. b) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 21 phase b rotation direction control pin (ch. b) appl y a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 22 osc external capacitor pin fo r triangular-wave oscillation 23 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 24 gnd ground pin gnd gnd v re g v cc sb osc phase a phase b x1a x1b x2a x2b v cc v cc out1a out1b v re f a v re f b rsa rsb out2a out2b gnd gnd 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 gnd 1 30 gnd v re g 2 29 v cc sb 3 28 osc phase a 4 27 phase b x1a 5 26 x1b x2a 6 25 x2b gnd 7 24 gnd gnd 8 23 gnd gnd 9 22 gnd v cc 10 21 v cc out1a 11 20 out1b v re f a 12 19 v re f b rsa 13 18 rsb out2a 14 17 out2b gnd 15 16 gnd tb6562ang TB6562AFG
tb6562ang/afg < TB6562AFG > pin no. symbol function description remarks 1 gnd ground pin 2 v reg 5 v output pin connect a capacitor between this pin and the gnd pin. 3 sb standby pin h: start, l: standby, built-in pull down resistance of 100 k ? (typ.) 4 phase a rotation direction control pin (ch. a) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 5 x1a input pin used to set output current level (ch. a) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 6 x2a input pin used to set output current level (ch. a) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 7 gnd ground pin 8 gnd ground pin 9 gnd ground pin 10 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 11 out1a output pin 1 (ch. a) connect to a motor coil pin. 12 v ref a reference voltage external set pin (ch. a) 13 rsa resistance connect pin for detecting output current (ch. a) 14 out2a output pin 2 (ch. a) connect to a motor coil pin. 15 gnd ground pin 16 gnd ground pin 17 out2b output pin 2 (ch. b) connect to a motor coil pin. 18 rsb output current detection resistor connection pin (ch. b) 19 v ref b input pin for external reference voltage (ch. b) 20 out1b output pin 1 (ch. b) connect to a motor coil pin. 21 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 22 gnd ground pin 23 gnd ground pin 24 gnd ground pin 25 x2b input pin used to set output current level (ch. b) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 26 x1b input pin used to set output current level (ch. b) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 27 phase b rotation direction control pin (ch. b) apply a 0 v/5 v signal, built-in pull down resistance of 100 k ? (typ.) 28 osc external capacitor pin fo r triangular-wave oscillation 29 v cc power supply voltage input pin v cc (opr) = 10 v to 34 v 30 gnd ground pin 2012-09-28 4
tb6562ang/afg absolute maximum ratings (t a = 25c) characteristic symbol rating unit power supply voltage v cc 40 v output voltage v o 40 v output current i o (peak) 1.5 (note 1) a input voltage v in ?0.2 to 5.5 v power dissipation p d 2.5 (note 2) w operating temperature t opr ?20 to 85 c storage temperature t stg ?55 to 150 c junction temperature t j max 150 c note 1: output current may be controlled by ex citation mode, ambient temperature, or heatsink. when designing a circuit, ensure that the maximum junction temperature, t j max = 150c, is not exceeded when the ic is used. avoid using the ic in abnormal cond itions that would cause the t j to exceed 150c, even though the heat protection circuit of the ic will continue to operate in such conditions. note 2: when mounted on a board (50 mm 50 mm 1.6 mm, cu area: 50%) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. please use the ic within the specified operating ranges. operating range (t a = ?20 to 85c) characteristic symbol rating unit power supply voltage v cc 10 to 34 v input voltage v in 0 to 5 v vref voltage v ref 0.5 to 7.0 v pwm frequency f pwm 15 to 80 khz triangular-wave oscillation frequency f osc 45 to 400 khz 2012-09-28 5
tb6562ang/afg electrical characteristics (v cc = 24 v, t a = 25c) characteristic symbol test circuit test condition min typ. max unit i cc1 xt1a = xt2a = h, xt1b = xt2b = h output = open D 6.5 10 i cc2 xt1a = xt2a = l, xt1b = xt2b = l output = open D 7.0 12 supply current i cc3 D standby mode D 2.0 4.0 ma v inh D 2.3 D 5.5 input voltage v inl D D -0.2 D 0.8 input hysteresis voltage v in (hys) D (target spec.) D 0.4 D v i inh v in = 5 v 30 50 75 control circuit (note 1) input current i inl D v in = 0 v D D 5 a v insh D 2.3 D 5.5 input voltage v insl D D ?0.2 D 0.8 input hysteresis voltage v in (hys) D (target spec.) D 0.4 D v i insh v in = 5 v 30 50 75 standby circuit input current i insl D v in = 0 v D D 5 a i o = 0.2 a D 1.5 2.0 output on-resistance r on (u+l) D i o = 1.5 a D 1.5 2.0 ? i l (u) v cc = 40 v D D 10 output leakage current i l (l) D v cc = 40 v D D 10 a v f (u) i o = 1.5 a D 1.3 2.0 diode forward voltage v f (l) D i o = 1.5 a D 1.3 2.0 v internal reference voltage v reg D when current of 1 ma is loaded. 4.75 5 5.25 v input current i ref D v ref = 0.5 v D 5 10 a v ref (1/10) D x1 = x2 = l v ref = 5 v 0.45 0.5 0.55 v ref (1/15) D x1 = l, x2 = h v ref = 5 v 0.28 0.33 0.38 vref circuit current limit voltage v ref (1/30) D x1 = h, x2 = l v ref = 5 v 0.12 0.17 0.22 v triangular-wave oscillation frequency f osc D c = 4700 pf 88 110 132 khz thermal shutdown circuit operating temperature t sd D (target spec.) D 160 D c note 1: phase, x1 and x2 pins 2012-09-28 6
tb6562ang/afg truth tables < 2-phase excitation > (*) i o : out1 out2; + current out2 out1; current phase a phase b input output input output phase a x1a x2a i o (a) phase b x1b x2b i o (b) h l l 100% h l l 100% l l l 100% h l l 100% l l l 100% l l l 100% h l l 100% l l l 100% < 1?2-phase excitation > phase a phase b input output input output phase a x1a x2a i o (a) phase b x1b x2b i o (b) h l l 100% h l l 100% x h h 0% h l l 100% l l l 100% h l l 100% l l l 100% x h h 0% l l l 100% l l l 100% x h h 0% l l l 100% h l l 100% l l l 100% h l l 100% x h h 0% < w 1?2-phase excitation > phase a phase b input output input output phase a x1a x2a i o (a) phase b x1b x2b i o (b) x h h 0% l l l 100% h h l 33.3% l l l 100% h l h 66.7% l l h 66.7% h l l 100% l h l 33.3% h l l 100% x h h 0% h l l 100% h h l 33.3% h l h 66.7% h l h 66.7% h h l 33.3.% h l l 100% x h h 0% h l l 100% l h l 33.3% h l l 100% l l h 66.7% h l h 66.7% l l l 100% h h l 33.3% l l l 100% x h h 0% l l l 100% l h l 33.3% l l h 66.7% l l h 66.7% l h l 33.3% l l l 100% 2012-09-28 7
tb6562ang/afg timing charts timing charts may be simplified for explanatory purposes . < 2-phase excitation > i o (a) 100 ? 100 100 ? 100 h l h l h l h l h l h l i o (b) phase a x1a x2a phase b x1b x2b (*) i o : out1 out2; + current out2 out1; 9 current < 1?2-phase excitation > h l h l h l h l h l h l phase a x1a x2a phase b x1b x2b i o (a) 100 0% ? 100 i o (b) 100 0% ? 100 (*) i o : out1 out2; + current out2 out1; 9 current 2012-09-28 8
tb6562ang/afg < w 1?2-phase excitation > h l h l h l h l h l h l phase a x1a x2a phase b x1b x2b i o (a) 100 66.7% 33.3% 0% ? 33.3 ? 66.7% ? 100% i o (b) 100 66.7% 33.3% 0% ? 33.3 ? 66.7% ? 100% (*) i o : out1 out2; + current out2 out1; 9 current 2012-09-28 9
tb6562ang/afg 2012-09-28 10 pwm current control the ic enters cw (ccw) mode and short brake mode alternately during pwm current control. to prevent shoot-through current caus ed by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generated for 300 ns (target spec) when the upper and lower transistors are being switched. therefore synchronous rectification fo r high efficiency in pwm current co ntrol can be achieved without an off-time generated via an external input. even for toggling between cw and ccw modes, and cw ( ccw) and short brake modes, no off-time is required due to the internally generated dead time. constant current regulation when v rs reaches the reference voltage (v ref ), the ic enters discharge mode. after four clock signals are generated from the oscillator, the ic mo ves from discharge mode to charge mode. v cc m rs v cc m rs pwm on t5 pwm off on t4 = 300 ns (typ.) v cc m rs pwm off t3 pwm on off t2 = 300 ns (typ.) v cc m rs out1 out1 out1 out1 v cc m rs pwm on t1 out1 internal clock discharge charge v re f osc v rs gnd discharge v rs v re f
tb6562ang/afg transition from charge mode to discharge mode if v rs > v ref after four clock signals in charge mode, the ic again enters discharge mode. after a further four clock signals in discharge mode, v rs is compared with v ref . if v rs < v ref , the ic operates in charge mode until v rs reaches v ref . internal clock discharge charge discharge charge v re f v rs osc gnd transition from discharge mode to charge mode even when the reference voltage has risen, discharg e mode lasts for four clock signals and is then toggled to charge mode. internal clock discharge discharge charge v re f v rs osc gnd timing charts may be simplified for explanatory purposes. internal oscillation frequency (f osc ) the internal oscillation frequency is approximated by the formula below: f osc = 1/(0.523 (c osc 3700 c osc 600)). 2012-09-28 11
tb6562ang/afg reference voltage generator the current value at 100% is determined by applying voltage at the v ref pin. the value can be calculated as follows: i o (100 ) = v ref 1/10 1/rs[a] (x1 = x2 = l) decoder control circuit v cc m i o out1 1/10 1/15 1/30 rs vref x1 x2 i o out2 thermal shutdown circuit (tsd) the ic incorporates a thermal shutdown circuit. when the junction temperature (t j ) reaches 160c (typ.), the output transistors are turned off. the output transistors are turned on automatically. the ic has 40c temperature hysteresis. tsd = 160c (target spec) tsd = 40c (target spec) overcurrent protection circuit (isd) the ic incorporates an overcu rrent protection circuit to detect voltage flowing through the output transistors. the overcurrent threshold is 2.5 a (typ.). currents flowing through the eight output transistors are monitored individually. if overcurrent is detected in at least one of the tran sistors, all transistors are turned off. the ic incorporates a timer to count the 50 s (typ.) for which the transistors are off. after the 50 s, the transistors are turned on automatically. if an overcurrent occurs again, the sa me operation is repeated. to prevent false detection due to glitches, the circuit turns off the transistors only wh en current exceedin g the overcurrent threshold flows for 10 s or longer. i lim 50 s (typ.) 0 10 s (typ.) not detected 50 s (typ.) 10 s (typ.) output current the target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 a (typ.), and varies in a range from approximately 1.5 a to 3.5 a. these protection functi ons are intended only as a te mporary means of preventing ou tput short circuits or other abnormal conditions and are not guaranteed to prevent damage to the ic. if the guaranteed operating ranges of this product are exceeded, these prot ection features may not operate and some output short circuits may result in the ic being damaged. the overcurrent protection feature is intended to protect the ic fr om temporary short circuits only. short circuits persisting over long periods may cause excessive stress and damage the ic. systems should be configured so that any overcurrent conditio n will be eliminated as soon as possible. 2012-09-28 12
tb6562ang/afg 2012-09-28 13 application circuit the application circuit below is for reference only and requ ires thorough evaluation at t he mass production design stage. in furnishing this example of an application circuit, toshiba does not grant the use of any industrial property rights. note 1: a power supply capacitor should be connected between v cc and rsa (rsb), and as close as possible to the ic. note 2: c2 and c3 should be connected as close as possible to s-gnd. note 3: in powering on, set the ic as follows: sb = low (standby mode) or xa1 = xa2 = xb1 = xb2 = high (current value = 0%) note 4: when the v ref is being changed, a dac output c an be connected directly to the v ref pin. note 5: the v cc pins (pin 10, pin 21, and pin 29) should be shorted externally. note 6: connect the capacitor c4 to the v ref to reduce the switching noise. (note 2) 24 v v cc osc v reg gnd out1a rsa TB6562AFG 2 28 10 21 29 3 4 5 6 27 26 25 11 14 13 20 17 18 port1 port2 port3 port4 port5 port6 port7 port8 port9 gnd dac output signal sb phase a x1a x2a phase b x1b x2b 12 19 out2a out1b rsb out2b v ref av ref b 1, 7, 8, 9, 15, 16, 22, 23 24, 30 c1 c2 c3 (note 4) (note 1) r1 r1 r2 v dd stepping motor 5 v v cc v cc c4
tb6562ang/afg package dimensions weight: 1.62 g (typ.) 2012-09-28 14
tb6562ang/afg weight: 0.63 g (typ.) 2012-09-28 15
tb6562ang/afg notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor de vice are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic fa ilure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and in sertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 2012-09-28 16
tb6562ang/afg points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as cu rrent limiter circuits) do not necessarily protect ics under all circumstances. if the over current protection circuits operate against the over current, clear the over current status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or dr iver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, de terioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (4) back-emf when a motor rotates in the reverse direction, stop s or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design. 2012-09-28 17
tb6562ang/afg 2012-09-28 18 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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